IPC

Association Connecting Electronics Industries:IPC serves more than 2,300 member companies worldwide involved in designing, manufacturing, specifying and/or using printed circuit boards. Approximately 200 standards, guidelines and technical reports cover topics ranging from design and printed circuit board manufacturing to electronics assembly and testing.
$70.00
Acceptability of Electronic Assemblies STANDARD by Association Connecting Electronics Industries, 07/01/2014. Product Details Edition:F Published: 07/01/2014 Number of Pages:440 File Size: 1 file , 17 MB Full Description IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable...
$80.00
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications STANDARD by Association Connecting Electronics Industries, 07/01/2013. Product Details Published: 07/01/2013 Number of Pages:36 File Size: 1 file , 990 KB Full Description This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering...
$35.00
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films STANDARD published 01/01/2013 by Association Connecting Electronics Product Details Published: 01/01/2013 Number of Pages:52 File Size: 1 file , 1.1 MB Full Description This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used...
$28.50
PWB Assembly Process Simulation for Evaluation of Electronic Components Association Connecting Electronics Industries / 10-Jul-1995 / 12 pages Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure...
$15.00
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement Association Connecting Electronics Industries / 01-Apr-1999 / 24 pages Covers the requirements and determines the nomenclature, definitions and physical requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in HDI applications. This specification also includes slash sheets, which can be used when purchasing nonwoven para-aramid reinforcement.
$28.50
Design Guide for RF/Microwave Circuit Boards Association Connecting Electronics Industries / 01-Jun-2002 / 30 pages This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used...
$33.50
Design Guide for High-Speed Controlled Impedance Circuit Boards Association Connecting Electronics Industries / 01-Mar-2004 / 53 pages Controlled impedance is the maintenance of some specified tolerance in the characteristic impedance of an interconnect line (transmission line) that is used to connect different devices on a circuit. Controlled impedance is often a design consideration for high-speed digital or high-frequency analog circuits. This guide is intended to be used by circuit...
$64.50
Optoelectronics Assembly and Packaging Technology Association Connecting Electronics Industries / 01-May-2003 / 161 pages This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging...
$28.50
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes Association Connecting Electronics Industries / 01-Jun-2001 / 24 pages During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a...
$28.50
Monotonic Bend Characterization of Board-Level Interconnects Association Connecting Electronics Industries / 01-Jun-2004 / 28 pages Keywords: JEDEC 9702
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General Requirements for Anisotropically Conductive Adhesives Films Association Connecting Electronics Industries / 01-Nov-1996 / 32 pages This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible...
$33.50
Design Guide for Protection of Printed Board Via Structures Association Connecting Electronics Industries / 01-Jul-2006 / 28 pages PC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in...
$22.50
Stencil Design Guidelines Association Connecting Electronics Industries / 01-Feb-2007 / 28 pages Now includes support for stencils used with lead free processes. This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste,...
$28.50
Resin Coated Copper Foil for Printed Boards Guideline Association Connecting Electronics Industries / 01-Nov-2007 / 19 pages This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
$44.00
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards Association Connecting Electronics Industries / 01-May-2006 / 34 pages This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and...
$54.00
Surface Insulation Resistance Handbook Association Connecting Electronics Industries / 01-Sep-2007 / 86 pages Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR...
$28.50
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices Association Connecting Electronics Industries / 01-Apr-2006 / 19 pages This document standardizes the Performance Parameters for Air Moving Devices. The phrase "Air Moving Device" (or "Air Mover") refers to equipment such as, fans, blowers and other forced air movement technologies. These Air Moving Devices are used in the electronics industry for the cooling of...
$33.50
Specification for Finished Fabric Woven from "E" Glass for Printed Boards Association Connecting Electronics Industries / 01-Jan-2006 / 19 pages Exhaustively covers the classification and requirements for finished fabrics woven from "E" glass fiber yarns. These yarns are formed from filaments of electrical-grade glass and are intended as reinforcing materials in laminated plastics for electrical and electronic uses. The fabrics covered by this specification are all of a...
$28.50
Metal Foil for Printed Board Applications Association Connecting Electronics Industries / 01-May-2008 / 36 pages This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between user and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met. 27...
$38.50
Component Packaging and Interconnecting with Emphasis on Surface Mounting Association Connecting Electronics Industries / 01-Mar-1988 / 138 pages This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. Product Code(s): SM-780(D)1